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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 2.9v to 5.5v input, 5a integrated mosfet single synchronous buck dc/dc converter bd91364bmuu general description rohm?s high efficiency switching regulator, bd91364bmuu, is a step-down converter designed to produce a low voltage output of 0.8v to 3.3v from a 2.9v to 5.5v power supply line. it offers high efficiency in all load ranges by automatic pfm/pwm adjustment. it employs an on-time control system to provide faster transient response to sudden change in load. features ? fast transient response with on-time control system. ? high efficiency for all load range with synchronous rectifier (nch/nch fet) and adaptive pfm/pwm system. ? adjustable soft-start function. ? thermal and uvlo protection. ? short-circuit current protection with timer latch. ? shutdown function. applications power supply for lsi including soc, dsp, micro computer and asic ? laptop pc / tablet pc / server ? lcd tv, storage devices (hdd / ssd) ? printer ? entertainment device ? secondary power supply key specifications ? input voltage range: 2.9v to 5.5v ? output voltage range: 0.8v to pvcc0.8v ? output current: 5.0a(max) ? switching frequency: 1.7mhz(typ) ? high side fet on resistance: 27m ? (typ) ? low side fet on resistance: 27m ? (typ) ? standby current: 0 a (typ) ? operating temperature range: -40c to +105c package w(typ) x d(typ) x h(max) vqfn20u4040m 4.00mm x 4.00mm x 0.50mm typical application circuit figure 1. typical application circuit vqfn20u4040m sw gnd pvcc a vcc en l co vout cbst fb ss bst pgd pgd vin bd91364bmuu cin css rs 22f 22f 0.47h
datasheet d a t a s h e e t 2/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu pin configuration(top view) figure 2. pin configuration pin description pin no. pin name function pin no. pin name function 1 sw switch pin 11 en enable pin (high active) 2 sw switch pin 12 pgd power good open drain pin 3 sw switch pin 13 res reserve pin, connect to ground 4 sw switch pin 14 ss soft start capacitor connection pin 5 sw switch pin 15 fb output voltage detect pin 6 pvcc high side fet source pin 16 rs remote sense ground pin 7 pvcc high side fet source pin 17 agnd ground 8 pvcc high side fet source pin 18 pgnd low side fet source pin 9 bst bootstrapped voltage input pin 19 pgnd low side fet source pin 10 avcc power supply input pin 20 pgnd low side fet source pin block diagram figure 3. block diagram 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 sw sw sw sw sw pvcc pvcc pvcc bst a vcc fb ss res pgd en pgnd pgnd pgnd a gnd rs
datasheet d a t a s h e e t 3/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu absolute maximum ratings (ta= 25c) parameter symbol rating unit avcc / pvcc voltage avcc/pvcc -0.3 to +7 (note 1) v en voltage ven -0.3 to +7 (note 1) v bst voltage vbst -0.3 to +13 v bst_sw voltage vbst-sw -0.3 to +7 v sw voltage vsw -0.3 to +7 v ss/fb/pgd/rs voltage vss/ vfb vpgd/ vrs -0.3 to +7 v power dissipation 1 pd1 0.8 (note 2) w power dissipation 2 pd2 1.7 (note 3) w power dissipation 3 pd3 2.7 (note 4) w operating temperature range topr -40 to +105 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note 1) pd,and tj=150c should not be exceeded. (note 2) 1-layer. mounted on a 74.2m m x 74.2mm x 1.6mmt glass-epoxy board, occupied area by copper foil : 0mm 2 (note 3) 2-layer. mounted on a 74.2m m x 74.2mm x 1.6mmt glass-epoxy board, occupied area by copper foil : 5505mm 2 , in each layers. (note 4) 4-layer. mounted on a 74.2m m x 74.2mm x 1.6mmt glass-epoxy board, occupied area by copper foil : 5505mm 2 , in each layers. recommended operating conditions (ta= -40c to +105c) parameter symbol min typ max unit power supply voltage avcc 2.9 5.0 5.5 v pvcc 2.9 5.0 5.5 v en voltage ven 0 vcc 5.5 v output voltage range vout 0.8 - pvcc0.8 v sw average output current isw - - 5 (note 5) a (note 5) pd should not be exceeded.
datasheet d a t a s h e e t 4/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu electrical characteristics (unless otherwise specified ta= 25 c avcc=pvcc=5v, en=vcc, r1=200k ? , r2=51k ? ) parameter symbol min typ max unit conditions avcc and pvcc voltage range vin 2.9 - 5.5 v standby supply current istb - - 3 a en=gnd operating supply current icc 100 150 200 a non-switching uvlo threshold voltage vuvlo1 2.650 2.750 2.850 v vcc rising uvlo release voltage vuvlo2 2.450 2.550 2.650 v vcc falling enable en low-level input voltage venl gnd - 0.8 v standby mode en high-level input voltage venh 1.8 - v cc v active mode en input current ien - 3 6 a ven=5v power good pg threshold voltage vpgth -20% -15% -10% v vfb-15% (typ) pg hysteresis voltage vpghys -25% -20% -15% v vfb-20% (typ) pg detect delay time pdelay 6 15 25 s open drain output resistance rpg 50 100 200 ? vfb datasheet d a t a s h e e t 5/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves figure 4. pfm operation, load 0ma figure 5. pfm operation, load 100ma figure 6. pwm operation, load 1000ma figure 7. pwm operation, load 5000ma sw pin 5v/div vout 100mv/div i inductor 2a/div sw pin 5v/div vout 100mv/div i inductor 2a/div pvcc=5v vout=1.0v l=0.47h pvcc =5v vout=1.0v l=0.47h 1s/div 1s/div sw pin 5v/div vout 100mv/div i inductor 2a/div sw pin 5v/div vout 100mv/div i inductor 2a/div pvcc =5v vout=1.0v l=0.47 h pvcc=5v vout=1.0v l=0.47 h 1s/div 1s/div
datasheet d a t a s h e e t 6/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued figure 8. 0.1a to 4a load transient response figure 9. 4a to 0.1a load transient response figure 10. start-up with pvcc figure 11. shutdown with pvcc vout 50mv/div io 2a/div pvcc=5v vout=1.0v co=22f l=0.47uh 0.1a 4a/sec vout 50mv/div io 2a/div pvcc=5v vout=1.0v co=22f l=0.47h 4a 0.1a/sec 4s/div 4s/div pvcc 5v/div en pin 5v/div vout 0.5v/div 500s/div pvcc=5v en=pvcc short vout=1.0v/1.0a l=0.47h pvcc 5v/div en pin 5v/div vout 0.5v/div 500s/div pvcc=5v en=pvcc short vout=1.0v/1.0a l=0.47h
datasheet d a t a s h e e t 7/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued figure 12. start-up with en figure 13. shutdown with en figure 14. pvcc variation 2.9v to 5.5v figure 15. pvcc variation 5.5v to 2.9v pvcc 5v/div en pin 5v/div vout 0.5v/div 500s/div pvcc=5v vout=1.0v/1.0a l=0.47h pvcc 5v/div en pin 5v/div vout 0.5v/div pvcc=5v vout=1.0v/1.0a l=0.47h pvcc 5v/div sw pin 5v/div vout 0.5v/div 500s/div 100s/div pvcc 5v/div sw pin 5v/div vout 0.5v/div 100s/div pvcc=5v vout=1.0v/1.0a l=0.47h pvcc=5v vout=1.0v/1.0a l=0.47h
datasheet d a t a s h e e t 8/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued figure 16. power good (start-up) figure 17. power good (shutdown) figure 18. power good delay figure 19. remote sense function en pin 2v/div vout 1v/div pgd pin 0.5v/div pvcc=5v vout=1.0v/10ma l=0.47h pgd=pull-up at 10k ? standby soft start normal operate en pin 2v/div vout 1v/div pgd pin 0.5v/div pvcc=5v vout=1.0v/10ma l=0.47h pgd= pull-up at 10k ? 500s/div normal operate 10s/div fb pin 0.2v/div pgd pin 0.2v/div pvcc=5v pgd= pull-up at 10k ? 40s/div rs pin 0.2v/div vout 0.2v/div pvcc=5v vout=1.0v/1.0a l=0.47 h 500s/div
datasheet d a t a s h e e t 9/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued figure 20. output ground fault 100s/div vout 1.0v/div pvcc=5v vout=1.0v l=0.47h sw pin 5.0v/div output current 5.0a/div
datasheet d a t a s h e e t 10/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued 20 22 24 26 28 30 32 34 36 38 40 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 resistance ? : ? ron ? [m ] input ? voltage ? : ? vin ? [v] input voltage : pvcc[v] 0 0.2 0.4 0.6 0.8 1 1.2 2 2.2 2.4 2.6 2.8 3 output ? voltage ? : ? vout ? [v] input voltage ? : ? vin ? [v] input voltage : pvcc[v] 0 10 20 30 40 50 60 70 80 90 100 0.001 0.01 0.1 1 10 efficiency ? : ?? [%] output ? current ? : ? iout ? [a] vo=3.3v vo=1.5v vo=1.0v 0 0.2 0.4 0.6 0.8 1 1.2 0.8 1 1.2 1.4 1.6 1.8 output ? voltage ? : ? vout ? [v] en voltage ? : ? ven ? [v] figure 21. en start-up figure 22. pvcc start-up figure 23. efficiency figure 24. power mosfet on-resistor ta=25c pvcc=5v vout=1.0v pvcc=5v vout=1.0v pvcc=ven ven=5v pvcc=5v l=fdv0420-h-r47 (toko) vout=1.0v vout=1.5v vout=3.3v
datasheet d a t a s h e e t 11/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued 0.995 ? 0.996 ? 0.997 ? 0.998 ? 0.999 ? 1.000 ? 1.001 ? 1.002 ? 1.003 ? 1.004 ? 1.005 ? 3.0 3.5 4.0 4.5 5.0 5.5 output ? voltage ? : ? vout ? [v] input ? voltage ? : ? vin ? [v] input voltage : pvcc[v] 80 ? 85 ? 90 ? 95 ? 100 ? 105 ? 110 ? 3.0 3.5 4.0 4.5 5.0 5.5 6.0 resistance ? : ? ron ? [m ] input ? voltage ? : ? vin ? [v] input voltage : pvcc[v] 0.98 ? 0.99 ? 1.00 ? 1.01 ? 1.02 ? 0 1000 2000 3000 4000 5000 output ? voltage ? : ? vout ? [v] output ? current ? : ? iout ? [ma] 0 1 2 3 4 5 6 0.60 0.62 0.64 0.66 0.68 0.70 power ? good ? voltage ? : ? pgood ? [v] feed ? back ? voltage ? : ? vfb ? [v] figure 25. powergood mosfet on-resistor figure 26. powergood voltage/hysteresis figure 27. output variation (load regulation) fi gure 28. output variation (line regulation) ta=25c pvcc=5v vout=1.0v l=0.47h vout=1.0v/1a l=0.47h
datasheet d a t a s h e e t 12/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu typical performance curves - continued 0.98 ? 0.99 ? 1.00 ? 1.01 ? 1.02 ? -40 -20 0 20 40 60 80 100 output ? voltage ? : ? vout ? [v] temperature ? : ? ta ? [ ] 100 120 140 160 180 200 0 1000 2000 3000 4000 5000 on ? time ?? [nsec] output ? current ? : ? iout ? [ma] 0 0.2 0.4 0.6 0.8 1 1.2 0246810 output ? voltage ? : ? vout ? [v] output ? current ? : ? iout ? [a] 0.0 ? 0.5 ? 1.0 ? 1.5 ? 2.0 ? 2.5 ? 0 1000 2000 3000 4000 5000 frequency ? : ? fosc ? [mhz] output ? current ? : ? iout ? [ma] figure 29. output variation (ambient temp erature) figure 30. ocp detection current figure 31. on-time variation (load regulation) figure 32. frequency variation (load regulation) pvcc=5v vout=1.0v/1a l=0.47h pvcc=5v vout=1.0v l=0.47h
datasheet d a t a s h e e t 13/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu application information operation bd91364bmuu is a buck synchronous rectif ication switching regulator capable of high speed transient response by implementing a constant on-time system as its hysteresis control. g eneral hysteresis control systems need a certain ripple to give an output voltage. furthermore, a high esr output capa citor is needed to maintain appropriate switching control. bd91364bmuu has a ripple implanted system at output detection which keeps a no rmal switching operation even if a low esr output capacitor is used. this feature also resolved a we akness of a regular hysteresis control, which is, to keep a steady frequency from a variation of frequencies. when operating with light loads, bd91364b muu reduce switching loss and attain hi gh efficiency by utilizing a pulse skip system. figure 33. constant on-time system block diagram description of operations 1. soft start function when en terminal is shifted to ?high?, it activates a soft-start function which gradually raises the output voltage while limiting the current at start up. this prevents an overshoot in output voltage by preventing start-up in-rush current. rise time is dependent on capacitor css connected to ss pin. vfb/is s cs s ts s ? ? [sec] ts s : soft-start time cs s : capacitor connected to soft-start pin v f b : fb voltage 0.8v (typ) is s : source current at soft-start pin 1.2a (typ) ex.) when css0.01 f 0.0 1 ts s ( ? [ f] 0. 8 ? [v] /1. 2 [ a] 67 6 . ? [msec] if en terminal is shifted to ?high? when capacitor css is not connected, ss pin is open or in ?high? condition, the output voltage will rise in 1msec (typ). 2. shutdown function with en terminal shifted to ?low?, the de vice turns to standby mode. all functional blocks including reference voltage circuit, internal oscillator and drivers are turned off. circuit current during standby is 0 a (typ).
datasheet d a t a s h e e t 14/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu 3. uvlo function uvlo detects whether the input voltage is sufficient to secure a desired ic output voltage. a hysteresis width of 200mv (typ) is provided to prevent output chattering. figure 34. soft start, shutdown, uvlo timing chart 4. power-good function when fb terminal voltage falls below 80%(0.64v) of the inter nal reference voltage, an open drain mos which is internally connected to pgd terminal turns on. this event pulls down the pgd terminal with a 100 ? (typ) impedance. when fb terminal voltage reaches 85%(0.68v) of the internal reference voltage, pgd terminal will enter a high impedance state after 15sec delay. this terminal is an open drain out put so a pull up resistor is needed for proper operation. figure 35. power-good timing chart hysteresis range 200mv tss tss tss soft start standby mode operation mode standby mode v cc en v out standby mode standby mode operation mode operation mode 0.68v 0.64v
datasheet d a t a s h e e t 15/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu 5. over current protection function/pu lse count short-circuit protection over current detection circuit is operating when the high side mos is on. when over current is detected, on/off duty will be controlled to decrease the output voltage. if over current is still present 1024 counts afte r output voltage falls below 80% of the set voltage (power good error), the output will be latched in off state to prevent ic damage. output is returned by resetting en or releasing uvlo again. figure 36. over current protection/short- circuit protection function timing chart 6. over shoot reduction (load responsive ness characteristic improvement function) output voltage rises when load current is decreased rapidly. normally, lg control signal is kept on turning on and the gradient of coil current ? il will be ? il = -vout/l. at this point, if slew rate, ? iout, of load current iout will be ? iout > ? il, excess current will be charged and output voltage will keep on rising (fig.37 dotted line waveform). when the output voltage is set to a low value, ? il will be small and output voltage will increase significantly. bd91364bmuu operates over shoot reduction when the low side power mos is kept on afte r twice the pwm pulse width. vf voltage is generated to the sw terminal by turning off the hg-lg and applying il th rough the body diode of the lowside mos. this makes ? il =(-vf-vout)/l and reduces the rise in output voltage by contro lling excess current not to be charged to output capacitor. figure 37. over short reduction timing chart iout il -vf vout hg lg pvcc l vout \ l vout \ v f \
datasheet d a t a s h e e t 16/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu 7. remote sense voltage drop is caused by an interconnection resistance, rx , present between the power supply ic output, vout, and the load, such as a system on a chip (soc). in addition, gnds terminal can get to a higher potential by an interconnection resistance ry between board gnd and gnds terminal of soc. th is voltage variation increases in proportion to the load current and may cause soc malfunction. bd91364bmuu remote circuit, as shown in fig.38, compensate s voltage variation caused by ry. the voltage in between vs and gnd is kept constant by sensi ng the voltage at gnds terminal and adding it to the ic?s reference voltage. as for interconnection resistance rx, voltage variation c an be prevented by monitoring the output voltage feedback line from the nearest soc input terminal, vs. figure 38. remote sense pvcc fb terminal vref vrefo rs wiring resistance : ry [m ? ] feedback resistor v vs io sw gnds vout board ground feedback resistor wiring resistance : rx [m ? ] soc, etc.
datasheet d a t a s h e e t 17/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu switching regulator efficiency % % % 10 0 p d pout pout 10 0 pin pout 10 0 iin vin iou t vou t ? ? ? ? ? ? ? ? ? efficiency may be improved by reducing the swit ching regulator power dissipation factors pd as follows: dissipation factors 1. on resistance dissipation of inductor and fet : pdi 2 r [w] 2. gate charge/discharge dissipation : pdgate [w] 3. switching dissipation : pdsw [w] 4. esr dissipation of capacitor : pdesr [w] 5. operating current dissipation of ic : pdic [w] (1) ? ? ?? ron rcoi l iout r i p d 2 2 ? ? ? [w] ( rcoil [ ? ] : dc resistance of inductor, ron [ ? ] :on resistance of fet, iout [a] : outputcurrent) (2) v 2 ? ? ? f cg s pdgate [w] ( cgs [f] : gate capacitance of fet, f [hz] : switching frequency, v [v] : gate driving voltage of fet) (3) idriv e f iout crs s pdsw ? ? ? ? vin 2 [w] ( crss [f] : reverse transfer capacitance of fet, idrive [a] : peak current of gate) (4) esr irms ? ? 2 pdesr [w] ( irms [arms] : ripple current of capacitor, esr [ ? ] : equivalent series resistance) (5) icc vin ? ? pdic [w] ( icc [a] : circuit current) consideration on permissible dissipation and heat generation since this ic functions with high efficiency without significa nt heat generation in most applicat ions, no special consideration is needed on permissible dissipation or heat generation. in ca se of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permiss ible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on resistance of fet are considered because the conduction losses are the most signi ficant among other dissipation mentioned abov e, such as gate charge/discharge dissipation and switching dissipation. ron ? ? iout p 2 [w] ronl ) d ( ronh ? ? ? ? 1 d ron [ ? ] d : on duty (=vout/vcc) ronh : on resistance of highside mosfet [ ? ] ronl : on resistance of lowside mosfet [ ? ] iout : output current [a] ex) when in vcc =5v, vout =1v, ronh =27m ? , ronl =27m ? , iout =5a by 0. 2 1/ 5 vout/vcc d ? ? ? ? ? 027 0 2 0 1 027 0 2 0 . . . . ? ? ? ? ? ron 0216 0 0054 0 . . ? ? 027 0 . ? [ ? ] figure 39. thermal derating curve (vqfn20u4040m) 0.67 5 0.02 7 5 p 2 ? ? ? [w] thermal design must be carried out with sufficient margin allowed with consideration on the dissipation above. 0 25 50 75 100 125 150 0 2.0 3.0 4.0 2.7w power dissipation: pd [w] 1.0 4.5 105 ambient temperature: ta [c] 1.7w 0.8w 4 layers (copper foil area: 5505mm 2 ) copper foil in each layers j-a=46.3.0c/w 2 layers (copper foil area: 5505m 2 ) copper foil in each layers. j-a=73.5c/w 1 layers (copper foil area: 0m 2 ) j-a=156.3c/w
datasheet d a t a s h e e t 18/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu external component selection 1. inductor (l) the inductance has great influence on the out put ripple current. as seen in the equation (1), the ripple current decre ases as the inductor and/or switching frequency increases. f vc c l vou t vout vc c i l ? ? ? ? ? [a] ??? (1) f : switching frequency [hz] il : output ripple current [a] efficiency is affected as the dissipation factor, pd(i 2 r) [w], pd(gate) [w], pd(sw) [w], changes with respect to the coil value and pfm frequency dependence on ripple current. bd91364bmuu is designed to have least dissipation in pfm and pwm, both about l = 0.33h to 0.47h. figure 40. output ripple current current flow that exceeds the coil rating brings the coil into magnetic saturation, which ma y lead to lower efficiency. select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. in addition, select a coil with a low resistance component (dcr , acr) to lessen coil dissipation and improve efficiency. 2. output capacitor (co) output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required for smooth ripple voltage. output ripple voltage is determined by the equation (2): es r i l vout ? ? [v] ??? (2) il : output ripple current [a] esr: equi valent series resistance of co [ ? ] figure 41. output capacitor ioc p vou t c o ts s ? ? [sec] ??? (3) tss : soft start time [sec] (refer to page10) iocp : over current detection [a] (min) about 6.5a there must be an adequate margin between the maximum rating and output voltage of the capacitor. against output voltage. a 22 f to 100 f ceramic capacitor is recommended. a capacitor with low esr is recommended order to reduce output ripple. if you connect many parallel cera mic capacitor(low esr) to vout. esr value is very small. please careful interfere with noise signal. maximum value of co must be considered as a large current is needed to charge co to vout set point during boot-up. th is current may trigger over current protection (ocp) and cause a normal boot-up failure. ?
datasheet d a t a s h e e t 19/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu 3. input capacitor (cin) input capacitor must be a low esr capacitor with a capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current irms is given by the equation (4): cin is recommended to 22f. ? ? vc c vout \ vc c vout iou t irm s ? ? [arms] ??? (4) irms [arms](max) when vout 2 v cc ? ? , 2 iout irm s ? [arms] ex) bd91364bmuu when vcc =5.5v, vout =2.75v, iout max=5a figure 42. input capacitor ? ? 2.7 5 5. 5 2.7 5 \ 5 2.7 5 5 irm s ? ? ? [arms] 4. feedback capacitor fix ontime control needs enough ripple voltage for stable f eedback voltage comparator operation. this ic is designed to respond to low esr output capacitor, such as ceramic capacitor, by injecting a ripp le to the feedback voltage. in order to inject appropriate ripple, a feedback capacitor of 100pf to 200pf is recommended. 5. output voltage determination the output voltage vout is dete rmined by the equation (5): ?? vfb ? ? ? 1 r2/r 1 v ou t [v] ??? (5) vfb :fb terminal voltage(0.8v typ) with r1 and r2 adjusted, the output vo ltage may be determined as required. output voltage setting range is 0.8v to pvcc0.8v use about 100k ? resistor for r1 and r2 to consider loss at the pfm. figure 43. output voltage setting resistor caution when reducing input voltage figure 44. output and input voltage difference limits pvcc l co vout cin output voltage decreases below set value when input voltage is not sufficient. the decrease in output voltage is not only dependent on ic characteristics. it is also affected by the output load current and by the inductor?s dcr. fig.39 shows output voltage condition when output voltage is set to 3.3v and input voltage is lowered in varying load current condition (l=fdsd0420-h-r47 : dcr=15m ? typ). basically pvcc0.8 vout is set as specification range, but in case this condition is not sati sfied, the output voltage goes lower than the set value like in figure 44. load 0a 1a 3a 5a uvlo detection vout=3.3v l=fdsd0420-h-r47 dcr=15m ? sw a dj l co r2 r1 output
datasheet d a t a s h e e t 20/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu application information figure 45. recommended part circuit 1. pin 11, en provide control signal externally when controlling the output via enable terminal. 2. pin 13, res connect to ground. 3. pin 16, rs connect rs to ground sense point when using remote sense function. connect to agnd(ground) if not in use. 4. rpg pull-up resistor for power good function. keep pin 12(pgd) open or connect it to gr ound when power good function is not in use. 5. c ss capacitors for soft start time setting. a default 1msec soft start time is set if pin 14(ss) is left open. recommendation parts list part no value manufacturer part number u1 - rohm bd91364bmuu l sw 0.47h toko fdsd0420-h-r47m c o 22f murata grm32er61e226 cin(note6) 22f murata grm21br60j226 cbst 0.1f murata grm15 series 1005 c ss 1000pf murata grm15 series 1005 cfbu 200pf murata grm15 series 1005 cf 1000pf murata grm15 series 1005 rfbd 200k ? rohm mcr01 series 1005 rfbu 51k ? rohm mcr01 series 1005 rf 100 ? rohm mcr01 series 1005 rpg 100k ? rohm mcr01 series 1005 (note6) for capacitance of input capacitor take temperature c haracteristics,dc bias characterist ics,etc. into consideration to set minimum value to no less than 10uf.
datasheet d a t a s h e e t 21/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu notes for pcb layout figure 46. pcb layout ground sense interconnection should be carefully placed as input capacitors generate a large transient current. connect analog ground pin, agnd, to ground plane at point ? as shown in fig.46 to prevent high current from passing through the analog ground trace. vout ground, which carries a transient current, should be connected to ground plane at point ? . and feed back capacitor and resistor are arranged trace nearly fb input pin. and please be careful feed back line arranged trace for interfereing with noise signal. pvcc pvcc pvcc bst avcc rs agnd pgnd pgnd pgnd a b
datasheet d a t a s h e e t 22/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu i/o equivalence circuit figure 47. i/o equivalence circuit ? en pin ? sw pin ? fb pin ? ss pin ? bst pin ? pgd pin ? rs pin en 0.5m ? 0.9m ? 0.3m ? pvcc bst pvcc sw pgd 100 ? rs 40k ? 800k ? fb 10k ? a vcc ss 10k ? pvcc sw pvcc pvcc 1k ?
datasheet d a t a s h e e t 23/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. or 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet d a t a s h e e t 24/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu operational notes ? continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 48. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
datasheet d a t a s h e e t 25/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu ordering information b d 9 1 3 6 4 b m u u - z e 2 part number package muu:vqfn20u4040m packaging and forming specification e2: embossed tape and reel marking diagrams vqfn20u4040m (top view) 91364 part number marking lot number 1pin mark b
datasheet d a t a s h e e t 26/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu physical dimension, tape and reel information package name vqfn20u4040m ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 27/27 tsz02201-0j2j0aj00930-1-2 ? 2015 rohm co., ltd. all rights reserved. 27.jul.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd91364bmuu revision history date revision changes 27.jul.2015 001 new release
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
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